Phoenix Nanomex Neo 180

The phoenix micromeIx neo series combines high-resolution 2D X-ray technology and 3D CT in one system. Innovative and unique features and an extreme high positioning accuracy, make both systems the effective and reliable solution for a wide spectrum of 2D and 3D offline inspection tasks: R&D, failure analysis, process and quality control.

Key Features and Benefits:

  •  More detector options to better suit multiple applications
  •  An optimised X-ray tube to protect X-ray-sensitive components
  •  Industry leading detail detectability speed and image quality
  •  Enhanced software features for increased efficiency and ease of use

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nanome|x neo 180

X-ray detector

Option 1: Waygate Technologies high dynamic 200 µm pixel resolution detector Option 2: Superior 100 µm pixel resolution detector

Geometric magnification

max. 1,970x

Total magnification 27” Monitor

max. 2,700x

Detail detectability

up to 0.2 µm

X-ray tube type

Low maintenance open nanofocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated

Max. tube voltage/power on target

180 kV / 15 W

Diamond|window for up to 2 times faster data acquisition as the same high image quality level

Filament

Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange

Manipulator

Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange

Max. inspection area

460 mm x 360 mm (18” x 14”), 610 mm x 510 mm (24” x 20”) without rotation table

Max. sample size / weight

680 mm x 635 mm (27” x 25”) / 10 kg (22 lbs.)

ovhm – oblique view rotation

continuously adjustable view angle up to 70°, rotation 0° – 360°

Control

Joystick or mouse control (manual mode) and CNC (automatic mode)

Manipulation aids

Sample X-ray mapping, click’n-move-to function, click’n-zoom-to function, automatic isocentric manipulator movement

Positioning aid

laser crosshair

Anti-Collision System

May be deactivated for maximum magnification (tube touching the sample).

System dimensions (W x H x D)

2,160 mm x 1,920 mm x 1,590 mm (85” x 75.6” x 62.6”), (without control console)

Min. transportation width

1,590 mm (62.6”) (without control console)

Max. weight

appr. 3,100 kg / 6,835 lbs.

Radiation safety

The radiation safety cabinet is a full protective installation without type approval according to the German RöV and the US Performance Standard 21 CFR, Subchapter J. For operation, other official licenses may be necessary

Image processing software

phoenix x|act: comprehensive CAD based X-ray inspection software comprising image enhancement functions, measuring functions and fast and easy automated CAD based programming for automatic inspection

bga|module (standard): Intuitive automatic view based BGA solder-joint evaluation incl. automatic wetting analysis vc|module (standard): Intuitive automatic view based voiding calculation software package incl. capability

of multiple die attach voiding evaluation

Software Configuration (Option)

x|act BGA check strategy: automated CAD based analysis of BGA solder joints x|act PTH check strategy: automated CAD based analysis of PTH solder joints qfp|module: automated QFP solder joint evaluation

qfn|module: automated inspection of QFN / MLF solder joints pth|module: automated pin-through-hole solder joint evaluation

c4|module: view based evaluation of round solder joints with background structure, such as C4 bumps ml|module: view based registration of multilayer printed circuit boards

quality|review: visual interface for rework and failure indication FLASH!™: Waygate’s exclusive image optimization technology

Hardware Configuration (Option)  

Tilt / rotate unit: tilt ± 45° and rotation n x 360° for samples up to 2 kg
Manual bar code reader: for product identification

Computed Tomography (Option) Volume acquisition / reconstruction software: phoenix datos|x

Upgrade package for combined 2D / 3D (computed tomography) operation CT-unit: precision rotation axis Max. geom. magnification: 100 x (CT)

Max. voxel resolution: down to 2 μm, resolution depending on the sample size.

The nanoCT® function of the nanome|x allows a higher image sharpness.

Applications

  • NDT Electronics Testing Solutions
  • Real time inspection of solder joints and electronic components
  • Precision tools for inspecting semiconductors, PCBs and more
  • Utilised for a wide spectrum of 2D and 3D offline inspection tasks including R&D, failure analysis, process and quality control. 
  • Life science
  • Research and universities

Key Features & Benefits

  • Brilliant live inspectiom images 
  • Superior pixel resoluion (85/100Nm) detectors
  • Ease of use: inspection report is automatically generated after inspetion 
  • High positioning accuracy
  • Efficient CAD programming
  • High defect coverage and repeatability