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GE Phoenix Nanome|X Ultra High-Resolution Nanofocus X-ray System

The Phoenix Nanome|x is an ultra-high-resolution 2D X-ray and 3D CT in one system. A popular choice within the electronics and SMT industries, and for a wide spectrum of 2D and 3D offline inspection tasks.

With the X|act software package, the Phoenix Nanome|x empowers the operator in meeting actual and future defect requirements. Offers easy to program CAD based µAXI ensuring automated inspection in the micrometer range. Captures up to 30 frames per second and provides outstanding live imaging and fast 10 second, 3D scans.

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System Magnification and Resolution

Geometric magnification

DXR max. 1,970 x; max. 2,130 x with image intensifier.

Total magnification

DXR max. 2,660 x; max. 22,150 x with image intensifier.

Detail detectability

Up to 0.5 µm; nanome|x up to 0.2 µm.

180 kV Microfocus or Nanofocus X-ray Tube

Type

Low maintenance open microfocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated.

Maximal tube voltage

180 kV

Maximal tube output

20W (15W nanofocus tube without diamond window)

Target

Optional non-toxic diamond|window (tungsten on CVD support) for up to 2 times faster data acquisition at the same high image quality level.

Filament

Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange.

X-ray Detector

 

Type

High dynamic GE DXR250RT, temperature stabilized with active cooling for brilliant live imaging and extremely fast CT data acquisition. (Image intensifier and for nanome|x dual|detector configuration also available.)

Pixels

1000x 1000 pixels.

Resolution (pixel size)

200 x 200 micrometer.

Frame grabbing rate

Up to 30 fps at full frame.

Precise Manipulation

General construction

High-precision vibration-free synchronised 5-axes manipulation

Max. inspection area

460mm x 360mm (18" x 14") 610mm x 510mm (24" x 20") without rotation table

Max. sample size/weight

680mm x 635mm (27" x 25")/10kg (22lbs.)

ovhm – oblique view at highest magnification

Continuously adjustable view angle up to 70°, rotation 0°-360°

Control

Joystick or mouse control (manual mode) and CNC (automatic mode

Manipulation aids

Sample X-ray mapping, click'n-move-to function, click'n-zoom-to function, automatic isocentric manipulator movement, laser crosshair

Anti-Collision System

May be deactivated for maximum magnification (tube touching the sample)

System Dimensions

Dimensions (W x H x D)

2,020mm x 1,920mm x 1,860mm (79.5" x 75.6" x 73.2"); (D with console: 2,160 mm (85”

Min. transportation width

1,560mm (61.4")

Weight

Appr. 2,400kg / 5,292lbs.

Advanced Image Processing

phoenix x|act

Comprehensive CAD based X-ray inspection software comprising image enhancement functions, measuring functions and fast and easy automated CAD based programming for automatic inspection

bga|module (standard)

Intuitive automatic view based BGA solder-joint evaluation incl. automatic wetting analysis

vc|module (standard)

Intuitive automatic view based voiding calculation software package incl. capability of multiple die attach voiding evaluation

Software Configuration (Option)

x|act BGA check strategy

Automated CAD based analysis of BGA solder joints

x|act PTH check strategy

Automated CAD based analysis of PTH solder joints

qfp|module

Automated QFP solder joint evaluation

qfn|module

Automated inspection of QFN/MLF solder joints

pth|module

Automated pin-through-hole solder joint evaluation

c4|module

View based evaluation of round solder joints with background structure, such as C4 bumps

ml|module

View based registration of multilayer printed circuit boards

quality|review

Visual interface for rework and failure indication

Flash! FiltersTM

GE’s exclusive image optimization technology

planarCT module

Non destructive 2D slice and 3D volume board evaluation incl. 3D|viewer software

Hardware Configuration (Option)

Tilt/rotate unit

Tilt ± 45° and rotation n x 360° for samples up to 2kg

Manual bar code reader

For product identification

Computed Tomography (Option)

Upgrade package for combined 2D/3D (computed tomography) operation CT-unit

Precision rotation axis

Volume acquisition/ reconstruction software

Phoenix datos|x

Max. geom. magnification

100x (CT)

Max. voxel resolution

Down to 2µm, resolution depending on the sample size. The nanoCT® function of the nanome|x allows a higher image sharpness.

Applications

Ideal for inspecting high-quality assemblies and interconnections in the semiconductor and SMT industries. Utilised for a wide spectrum of 2D and 3D offline inspection tasks including R&D, failure analysis, process and quality control.

Xray Phoenix Nanomex pic1            Xray Phoenix Nanomex pic2

MOUNTED PRINTED CIRCUIT BOARDS       SEMICONDUCTOR AND OTHER ELECTRONIC COMPONENTS

Key Features

  • Superior dual detector technology for quality live images
  • High magnification
  • Precise manipulation
  • High repeatability
  • 180 kV / 15 W high-power open nanofocus tube with up to 200 nanometer detail detectability
  • Upgradeable to NanoCT and/or PlanarCT

Optional

  • Phoenix X|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Brilliant live inspection images due to high dynamic temperature-stabilized digital GE DXR detector with 30 fps (frames per second) and active cooling
  • 3D computed tomography scans within 10 seconds
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window
  • Offset|scan to scan bigger parts or the same size parts with higher resolution

Key Benefits

  • Combined 2D / 3D CT operation
  • Superior dual detector technology (digital image chain and active temperature-stabilized digital detector with 30 fps) for exceptional live images
  • Automation of inspection steps possible
  • Outstanding ease of use