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GE Phoenix Microme|X Microfocus X-ray System

This all-in-one high resolution 2D X-ray and computed tomography system has been specifically designed for real time X-ray inspection of electronic components and solder joints. A popular choice for failure analysis labs and production floors. Innovative and unique features, plus extreme high positioning accuracy make the Microme/x an effective and reliable solution for a wide spectrum of 2D and 3D inspection tasks.


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System Magnification and Resolution

Geometric magnification:

DXR max. 1,970 x; max. 2,130 x with image intensifier.

Total magnification:

DXR max. 2,660 x; max. 22,150 x with image intensifier.

Detail detectability:

Up to 0.5 µm; nanome|x up to 0.2 µm.

180 kV Microfocus or Nanofocus X-ray Tube


Low maintenance open microfocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated.

Max. tube voltage

180 kV

Max. tube output

20W (15W nanofocus tube without diamond window)


Optional non-toxic diamond|window (tungsten on CVD support) for up to 2 times faster data acquisition at the same high image quality level.


Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange.

X-ray Detector



High dynamic GE DXR250RT, temperature stabilized with active cooling for brilliant live imaging and extremely fast CT data acquisition. (Image intensifier and for nanome|x dual|detector configuration also available.)


1000x 1000 pixels.

Resolution (pixel size):

200 x 200 micrometer.

Frame grabbing rate

Up to 30 fps at full frame.

Precise Manipulation

General construction:

High-precision vibration-free synchronised 5-axes manipulation

Max. inspection area:

460mm x 360mm (18" x 14") 610mm x 510mm (24" x 20") without rotation table

Max. sample size/weight:

680mm x 635mm (27" x 25")/10kg (22lbs.)

ovhm – oblique view at highest magnification :

Continuously adjustable view angle up to 70°, rotation 0°-360°


Joystick or mouse control (manual mode) and CNC (automatic mode

Manipulation aids:

Sample X-ray mapping, click'n-move-to function, click'n-zoom-to function, automatic isocentric manipulator movement, laser crosshair

Anti-Collision System:

May be deactivated for maximum magnification (tube touching the sample)

System Dimensions

Dimensions (W x H x D):

2,020mm x 1,920mm x 1,860mm (79.5" x 75.6" x 73.2"); (D with console: 2,160 mm (85”

Min. transportation width:

1,560mm (61.4")


Appr. 2,400kg / 5,292lbs.

Advanced Image Processing

phoenix x|act:

Comprehensive CAD based X-ray inspection software comprising image enhancement functions, measuring functions and fast and easy automated CAD based programming for automatic inspection

bga|module (standard):

Intuitive automatic view based BGA solder-joint evaluation incl. automatic wetting analysis

vc|module (standard):

Intuitive automatic view based voiding calculation software package incl. capability of multiple die attach voiding evaluation

Software Configuration (Option)

x|act BGA check strategy:

Automated CAD based analysis of BGA solder joints

x|act PTH check strategy:

Automated CAD based analysis of PTH solder joints


Automated QFP solder joint evaluation


Automated inspection of QFN/MLF solder joints


Automated pin-through-hole solder joint evaluation


View based evaluation of round solder joints with background structure, such as C4 bumps


View based registration of multilayer printed circuit boards


Visual interface for rework and failure indication

Flash! FiltersTM:

GE’s exclusive image optimization technology

planarCT module:

Non destructive 2D slice and 3D volume board evaluation incl. 3D|viewer software

Hardware Configuration (Option)

Tilt/rotate unit:

Tilt ± 45° and rotation n x 360° for samples up to 2kg

Manual bar code reader:

For product identification

Computed Tomography (Option)

Upgrade package for combined 2D/3D (computed tomography) operation CT-unit:

Precision rotation axis

Volume acquisition/ reconstruction software:

Phoenix datos|x

Max. geom. magnification:

100x (CT)

Max. voxel resolution:

Down to 2µm, resolution depending on the sample size. The nanoCT® function of the nanome|x allows a higher image sharpness.


Designed for real time inspection of solder joints and electronic components, as well as for automatic inspection. Utilised for a wide spectrum of 2D and 3D offline inspection tasks including R&D, failure analysis, process and quality control.   

Xray Phoenix Nanomex pic1  Micromexapplication2  Micromexapplication1
Mounted PCB                                        Semi-Conductor                                   Power Electronics

Key Features

  • 180 kV / 20 W high-power microfocus tube with up to 0,5 µm detail detectability
  • Exceptional live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second)
  • X|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Precise manipulation
  • 3D computed tomography scans within 10 seconds (optional)
  • Optional offset|scan capability to scan bigger parts or the same size parts with higher resolution
  • Advanced planarCT option for slice or multislice package evaluation without overaying structures

 Key Benefits

  • Extremely high defect coverage and repeatability
  • Outstanding ease of use
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window as a new standard
  • Combined 2D / 3D CT operation