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GE Phoenix Microme|X Microfocus X-ray System

This all-in-one high resolution 2D X-ray and computed tomography system has been specifically designed for real time X-ray inspection of electronic components and solder joints. A popular choice for failure analysis labs and production floors. Innovative and unique features, plus extreme high positioning accuracy make the Microme/x an effective and reliable solution for a wide spectrum of 2D and 3D inspection tasks.

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System Magnification and Resolution

Geometric magnification:

DXR max. 1,970 x; max. 2,130 x with image intensifier.

Total magnification:

DXR max. 2,660 x; max. 22,150 x with image intensifier.

Detail detectability:

Up to 0.5 µm; nanome|x up to 0.2 µm.

180 kV Microfocus or Nanofocus X-ray Tube

Type

Low maintenance open microfocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated.

Max. tube voltage

180 kV

Max. tube output

20W (15W nanofocus tube without diamond window)

Target:

Optional non-toxic diamond|window (tungsten on CVD support) for up to 2 times faster data acquisition at the same high image quality level.

Filament:

Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange.

X-ray Detector

 

Type:

High dynamic GE DXR250RT, temperature stabilized with active cooling for brilliant live imaging and extremely fast CT data acquisition. (Image intensifier and for nanome|x dual|detector configuration also available.)

Pixels:

1000x 1000 pixels.

Resolution (pixel size):

200 x 200 micrometer.

Frame grabbing rate

Up to 30 fps at full frame.

Precise Manipulation

General construction:

High-precision vibration-free synchronised 5-axes manipulation

Max. inspection area:

460mm x 360mm (18" x 14") 610mm x 510mm (24" x 20") without rotation table

Max. sample size/weight:

680mm x 635mm (27" x 25")/10kg (22lbs.)

ovhm – oblique view at highest magnification :

Continuously adjustable view angle up to 70°, rotation 0°-360°

Control:

Joystick or mouse control (manual mode) and CNC (automatic mode

Manipulation aids:

Sample X-ray mapping, click'n-move-to function, click'n-zoom-to function, automatic isocentric manipulator movement, laser crosshair

Anti-Collision System:

May be deactivated for maximum magnification (tube touching the sample)

System Dimensions

Dimensions (W x H x D):

2,020mm x 1,920mm x 1,860mm (79.5" x 75.6" x 73.2"); (D with console: 2,160 mm (85”

Min. transportation width:

1,560mm (61.4")

Weight:

Appr. 2,400kg / 5,292lbs.

Advanced Image Processing

phoenix x|act:

Comprehensive CAD based X-ray inspection software comprising image enhancement functions, measuring functions and fast and easy automated CAD based programming for automatic inspection

bga|module (standard):

Intuitive automatic view based BGA solder-joint evaluation incl. automatic wetting analysis

vc|module (standard):

Intuitive automatic view based voiding calculation software package incl. capability of multiple die attach voiding evaluation

Software Configuration (Option)

x|act BGA check strategy:

Automated CAD based analysis of BGA solder joints

x|act PTH check strategy:

Automated CAD based analysis of PTH solder joints

qfp|module:

Automated QFP solder joint evaluation

qfn|module:

Automated inspection of QFN/MLF solder joints

pth|module:

Automated pin-through-hole solder joint evaluation

c4|module:

View based evaluation of round solder joints with background structure, such as C4 bumps

ml|module:

View based registration of multilayer printed circuit boards

quality|review:

Visual interface for rework and failure indication

Flash! FiltersTM:

GE’s exclusive image optimization technology

planarCT module:

Non destructive 2D slice and 3D volume board evaluation incl. 3D|viewer software

Hardware Configuration (Option)

Tilt/rotate unit:

Tilt ± 45° and rotation n x 360° for samples up to 2kg

Manual bar code reader:

For product identification

Computed Tomography (Option)

Upgrade package for combined 2D/3D (computed tomography) operation CT-unit:

Precision rotation axis

Volume acquisition/ reconstruction software:

Phoenix datos|x

Max. geom. magnification:

100x (CT)

Max. voxel resolution:

Down to 2µm, resolution depending on the sample size. The nanoCT® function of the nanome|x allows a higher image sharpness.

Applications

Designed for real time inspection of solder joints and electronic components, as well as for automatic inspection. Utilised for a wide spectrum of 2D and 3D offline inspection tasks including R&D, failure analysis, process and quality control.   

Xray Phoenix Nanomex pic1  Micromexapplication2  Micromexapplication1
Mounted PCB                                        Semi-Conductor                                   Power Electronics

Key Features

  • 180 kV / 20 W high-power microfocus tube with up to 0,5 µm detail detectability
  • Exceptional live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second)
  • X|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Precise manipulation
  • 3D computed tomography scans within 10 seconds (optional)
  • Optional offset|scan capability to scan bigger parts or the same size parts with higher resolution
  • Advanced planarCT option for slice or multislice package evaluation without overaying structures

 Key Benefits

  • Extremely high defect coverage and repeatability
  • Outstanding ease of use
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window as a new standard
  • Combined 2D / 3D CT operation