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Vapour phase soldering, the best soldering method achieving gentle heating and optimum quality in an inert atmosphere.

Vapour Phase Soldering, also known as condensation soldering, or vapour phase reflow, is the most flexible, simplest and most reliable reflow soldering method.

Vapour phase is ideally suited for all types of SMD/SMT components and base materials. It allows processing of all components without elaborate setup and without temperature profiling.

All soldering processes have one thing in common:

They are able to securely attach components onto the specified base material. The advantages of vapour phase are its greater process accuracy, higher quality solder joints, consistently repeatable heating, lower reflow costs, inert atmosphere and most importantly no component or substrate is exposed to any temperature higher than the boiling point of the liquid. Excellent for heat sensitive components in a lead free environment.

Read Blog artice here Are you struggling with Vapour Phase Processing  

Basic configuration

A chemically inert fluid is used for the heat transfer.
This fluid is non-corrosive, electrically non-conductive and does not deteriorate over time.

The boiling point is very accurate depending on the application; most commonly used fluids have boiling points between 200°C up to 235°C.

Other temperatures are also available.


The fluid is heated to boiling point and starts to evaporate, a layer of saturated vapour and condensing fluid covers the soldering area creating an inert (oxygen-free) atmosphere. The vapour's weight is greater than the surrounding air and forms a protective gas atmosphere (0 ppm oxygen) without the need for any additional gases (nitrogen). As soon as the SMD/SMT assembly is immersed into the vapour zone, the vapour condenses on the solder material and transfers its heat.

Irrespective of the time the solder material remains in the vapour its temperature can never exceed the defined maximum vapour temperature.

As a result, the vapour phase soldering process is ideal for reliable and repeatable process control.

The vapour phase soldering process achieves perfect results on a wide range of assemblies, from flexible to multi-layer PCBs, ceramic or composite substrates all with reliable, repeatable results and without overheating.


About IBL Loettechnik

IBL Loettechnik was founded in 1985 and has focused on the development, production and sales of vapour phase soldering systems and associated products.

IBL continues to further develop the acceptance of vapour phase technology and holds numerous national and international patents such as the patented Soft Vapour Phase (SVP) which provides the benchmark in quality, flexibility and robustness for vapour phase soldering.

IBL vapour phase soldering machines are available for all soldering applications and throughput requirements.

Batch soldering machines start with the MiniLab which is ideal for laboratory and prototyping, followed by the SV260 and SV360 economy series, satisfying the highest demands in process stability and flexibility with the Premium SLC / BLC systems.

Inline Vapour Phase machines begin with the SLC / BLC series in combination with an inline module, are designed for high throughput in the LV600 and push the limits in throughput robustness and process quality in the CM800 with double soft vapour technology.

Vacuum soldering machines are special in the field of vapour phase soldering. Vacuum soldering technology with maximum solder quality for void free soldering is in daily use within the power electronics industry, for the soldering safety relevant circuits and for micro solders joints.

The vacuum vapour phase soldering machines VAC665 / VAC645 are available as batch and as inline vapour phase systems.

Customized Vapour Phase machines like the SLC1204 can be made for special needs of our customers.

IBL vapour phase machines work great with Galden® vapor phase fluids.

IBL Range: 

Batch Soldering Machine | MiniLab

MiniLab Vapour phase soldering
  • Ideal for development, prototyping and mini series production
  • Board Sizes up to 300 x 275 x 60 mm
  • Desktop unit
  • Low energy and fluid consumption with integrated heat exchanger
  • Easy operation due to soldering automatic and patented process
  • 230 V operation

Download Datasheet    |   Download Brochure

Batch Soldering Machine | SV260

IBL Vapour Phase SV260
  • Coloured touch panel
  • Integrated profiling-option
  • Suction possibility
  • Optimised for laboratory operation, prototyping and small series production
  • Board size up to 300 x 260 x 60 mm
  • Desktop unit with easy front loading
  • Low eneragy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Easy operation, clever soldering automatic, program storage
  • Easy profile recording profile
  • 230 V operation

Download Datasheet    |   Download Brochure

Batch Soldering Machine | BLC 420

IBL Inline Vapour Phase

  • New design with small footprint
  • Big touch screen with comfortable operation
  • Cost saving due to 2 chamber design and medium recovery
  • As batch or inline avaliable
  • Maximum solder quality and flexibility
  • Wide variety of adjustable solder proifiles
  • Integrated cooling fan
  • Comfortable temperature measuring and profiling with 4 internal chanels
  • Medium level check
  • Permanent data collection

Download Datasheet  |   Download Brochure

Batch Soldering Machine | BLC 540

SV540 open

  • Powerful unit for single and series production
  • Board sizes up to 560 x 360 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2 chamber design and integrated hear exhanger
  • Touch panel for easy operation, solder automatic, program storage
  • Live temperature monitoring without high temperature profiler
  • Maintenance free transport system (patented)
  • Integrated fluid filter system
  • Obcerstaion window into process chamber

Download Datasheet  |  Download Brochure

Vaccum Vapour Phase Reflow | VAC 745

VAC745 front left open 2

  • Void free solder joints with highest quality
  • Inert atmosphere during the whole reflow and vacuum process
  • Wide variety of adjustable solder profiles
  • Low medium consumption due to 2 chamber design and medium recovery
  • Temperature recording and profiling with 4 integrated channels
  • Permanaent data colletion 
  • Medium level check and automatic medium filtering
  • Integrated cooling fan
  • Automatic monitoring of vacuum process
  • Maintenance-free transport system (patented)

Download Datasheet  |  Download Brochure

Inline Vapour Phase Reflow | CX 800


  • Vapor Phase Inline System for high volume throughput
  • A cycle time of under 20sec. per board per is possible
  • Carrier sizes from 680 x 650 x 80mm up to 825 x 650 x 80mm
  • Fully automatic inline operation
  • Two independant stations for loading and unloading of carriers
  • Loading and unloading conveyors with buffer function
  • Three interanl processes chambers with automatic airlocks
  • Lowest energy and fuid consumption with energy management systems

Download Datasheet  |  Download Brochure


Hawker Richardson also supplies semi automated and fully automatic in-line SMT / SMD stencil and screen printers, Pick and place machines and reflow soldering ovens and wave solder machines. As well as a range of ancillary products such as Electroformed [eform] or laser cut stencils and precision stainless steel or polyester mesh screens plus solder paste. PCB storage magazines, board handling equipment and de-paneling machines, AOI systems and assembly tools such as electric torque drivers and screw presenters.

Allow Hawker Richardson to be your partner in productivity.

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