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BGA Rework Station Pro-650 for PCB

The Complete Rework SolutionPro-650 is the most popular BGA rework station with touch screen control, 3 individual zones, 6 bottom heater with height adjustable, programmable top/bottom heating, 50X high resolution camera system, 3 thermcouples for real-time profiling.

 See BGA Rework Station Brochure Here

PCB rework station for PCB

- High-definition optical alignment system(50X)
- Manual X-and Y-axis optics positioning
- Automated Z-axis for removal, placement, soldering
- Micrometer-adjust X-, Y-, and Ø-axis lead-to-pad alignment
- Three thermocouple inputs
- 380*290mm IR Bottom heater

1. Using linear slides on all 3 Axis enables fine tuning and quick orientation with perfect positioning accuracy and ease of manoeuvrability.

2. Equipped with a touch panel interface and PLC control, to ensue it worls reliabily it can store multiple temperature profile. With password protection and a modify function while power on. The temperature profiles will be displayed on the touch screen.

3. Three temperature zones to heat up independently, convection heat in top zone, IR heat in the bottom, temperature precise control is in±2℃ BGA chips are removed automatically.

4. The hot air nozzle can be rotated in 360 degrees, the IR heater in the bottom will apply heat to the PCB board uniformly.

5. Utilising high accuracy K-type thermocouples for closed loop control. The PCB is positioned by a closed V-shape slot. The flexible and convenient universal nozzles can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package sizes.

6. A large power fan is used to cool down the PCB quickly. The built-in vacuum pump and external nozzle are able to remove any BGA chips automatically.

7. System is CE certified. Utilising an emergency stop switch, all the power is turned off quickly


PCB rework station

PCB SPECIFICATION                            

PCB Size(Minimum)


PCB Size(Maximum Allowable)

PCB Size(Recommended Max.) 350×200mm
PCB Thickness 0.5mm-6mm

Component Specification
Component Size

MAX 55*55mm MIN 2*2mm
Minimum BGA Ball pitch 0.3mm
Placement Precision ±0.03 mm
Heating System
IR Bottom-heater 380×290mm(2700W)
Component heater(Top) Hot Air 800W
Component heater(Bottom) Hot Air 1200W
Temperature Control K-Type Thermocouple; Closed Loop PID
Main Power Source Single phase AC220V 50/60Hz
Total Power Consumption 4800W
Machine Dimensions L610×W670×H900mm
Net Weight 68kg



Hawker Richardson BGA rework station



High-definition optical alignment system(50X)
Auto Z-axis motion and dual-pressure sensor
Micrometer adjustment for X/Y-axis and R-angle(Calibrated)
6-Zone IR Bottom heater with height adjustable
3 Thermocouple inputs
Laser alignment device can help realize fast alignment
2 adjustable PCB bottom-side support beams
4 adjustable PCB bottom-side support Pins
Touch Screen + PLC+High precision intelligent control module
Led light
15" LCD Display

1 pc.50*50mm Bottom heating outlet
1 pc.20*20mm Top heating outlet
1 pc.28*28mm Top heating outlet
1 pc.35*35mm Top heating outlet
1 pc.8mmVaccum Nozzle                                                                                                               Integrated design for upper temperature zone
1 pc.10mm VaccumNozzle                                                                                                                                      
4 pc.silicone tips
3 pcs.K-type thermocouples with connectors
1pcs.Top heater
1pcs.Bottom IR heater

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