Yamaha i-PULSE S20 SMT Pick and Place Machine

The Yamaha i-Pulse S20 fulfills the need for higher throughput in the flexible assembly and LED lighting sectors. The new high capacity head system addresses the need for faster cycle times and provides ultra-large PCB handling capabilities with higher placement rates.


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Yamaha i-PULSE S20 



Board size(with buffer unused)

Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)

Board size(with input or output buffer used)


Board size(with input and output buffers used)

Min. L50 x W30mm to Max. L540 x W510mm

Board thickness

0.4 - 4.8mm

Board flow direction

Left to right (Std)

Board transfer speed

Max 900mm/sec

Placement speed (12 heads + 2 theta) Opt. Cond.

0.08sec/CHIP (45,000CPH)

Placement accuracy A (μ+3σ)

CHIP +/-0.040mm

Placement accuracy B (μ+3σ)

IC +/-0.025mm

Placement angle

+/-180 degrees

Z axis control / Theta axis control

AC servo motor

Component height

Max 30mm*1 (Pre-placed components: max 25mm)

Applicable components

0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)

Component package

8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray

Drawback check

Vacuum check and vision check

Screen language

English, Chinese, Korean, Japanese

Board positioning

Board grip unit, front reference, auto conveyor width adjustment

Component types

Max 180 types (8mm tape), 45 lanes x 4

Transfer height

900 +/- 20mm

Machine dimensions, weight

L1750xD1750xH1420mm, Approx. 1,500kg


Specifications and appearance are subject to change without prior notice.
Board thickness + Component height = Max 30mm. 


The highly flexible S20 is available with the new head system incorporating 12 spindles with a wide component handling range. The S20 utilises the same fast change feeder bank and tray handler capabilities as the popular M20 and has a feeder capacity of up to 180 feeder positions. The optional camera will allow placement of parts down to 0.2 x 0.1 mm fulfilling the current demands on reduced component and ball sizes.


  • Defence applications
  • Industrial applications
  • Medical services
  • Consumer electronics

Key Features & Benefits

  • High feeder capacity 180 lanes
  • Large board handling up to 1,455 x 510 mm as standard
  • Wide range component handling capability
  • Surface mounting is now possible on concave-convex, sloped and curved surfaces
  • Reduction in the number of components and man-hours required in assembly work
  • Laser board warp detection