Search

Login
1300 36 00 31

Yamaha i-PULSE S10 Surface Mounter

Yamaha i-PULSE S10 Surface Mounter

Yamaha's i-Pulse S10 is a 3D hybrid surface mounter offering all the benefits of a full-size system, in a compact, small footprint machine. Equipped with high feeder capacity and large board handling, the S10 is suited to single machine or modular line applications and a high capacity placement head. 

 

 

ENQUIRE NOW

Please provide a name
Invalid Input
Invalid Input
Please provide an Email
Invalid Input
Invalid Input
Invalid Input

Brochure

Yamaha i-PULSE S10 

Videos

  

S10

  

Board size(with buffer unused)

Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)

Board size(with input or output buffer used)

Min. L50 x W30mm to Max. L420 x W510mm

Board size(with input and output buffers used)

Min. L50 x W30mm to Max. L330 x W510mm

Board thickness

0.4 - 4.8mm

Board flow direction

Left to right (Std)

Board transfer speed

Max 900mm/sec

Placement speed (12 heads + 2 theta) Opt. Cond.

0.08sec/CHIP (45,000CPH)

Placement accuracy A (μ+3σ)

CHIP +/-0.040mm

Placement accuracy B (μ+3σ)

IC +/-0.025mm

Placement angle

+/-180 degrees

Z axis control / Theta axis control

AC servo motor

Component height

Max 30mm*1 (Pre-placed components: max 25mm)

Applicable components

0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)

Component package

8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray

Drawback check

Vacuum check and vision check

Screen language

English, Chinese, Korean, Japanese

Board positioning

Board grip unit, front reference, auto conveyor width adjustment

Component types

Max 90 types (8mm tape), 45 lanes x 2

Machine dimensions, weight

L1250xD1750xH1420mm, Approx. 1,200kg

Overview

The highly flexible Yamaha i-Pulse S10 is available with an innovative head system incorporating 6 spindles with a wide component handling range. The S10 utilises the same fast change feeder bank and tray handler capabilities as the M10 and has a feeder capacity of up to 90 feeder positions. The optional camera allows placement of parts down to 0.2 x 0.1 mm fulfilling the current demands on reduced component and ball sizes.

Applications

  • Defence applications
  • Industrial applications
  • Medical services
  • Consumer electronics

Key Benefits & Features

  • Large board handling capacity up to 955 x 510 mm (as standard)
  • Max. feeder capacity 90 lanes
  • 6 placement heads
  • Wide range component handling capability
  • Laser board warp detection
  • Surface mounting is now possible on concave-convex, sloped and curved surfaces
  • Excellent setup capability suitable for high-mix-low-volume production