1300 36 00 31

VP-MINI Vapour Phase Machine

Condensation Reflow Soldering Machine. The DFA Mini is designed for reflow soldering laboratory and prototype, single pieces and small quantities PCB's. Components such as QFPs. BGAs, Flip Chips as well  hybrids are processed defect free with highest quality results.


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Energy Supply

(Single Phase + Neutral + Ground) 220-240 Volt / 50-60 Hz

Power Drawn

1.000 Watt (ca. 5 A)

System Dimensions

400 x 315 x 305 mm (L x W x H)

Max. Solder Product Format

240 x 170 x 20 mm (L x W x H)

Standard Cycle Time

ca. 10 Min

Soldering Time

ca. 60 – 120 Seconds (depends on products)

Process Temperature

(depends on medium type) 210 up to 240 °C


ca. 6 kg


Forced air cooling

Heat transfer medium

GALDEN with the correct boiling temperature (max. 240 °C)

Medium basic filling quantity

ca. 450– 500 ml GALDEN

**Technical changes reserved**


  • BGAs
  • Flip Chips
  • Laboratory
  • Small production

Key Benefits & Features

  • Max PCB Size - 240 x 170 x 20 mm
  • Table model top loader
  • Window to observe
  • Suitable for BGA's, stacked packages
  • Oxygen free soldering
  • Homogenous temperature transmission on the complete assembly
  • No overheating of components
  • Due to the small size of the system it can be used anywhere