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IBL CX600/CX800 Series Inline Vapor Phase Soldering Reflow Oven

  • Vapor Phase Inline System for high volume throughput
  • A cycle time of under 20 sec. per board is possible
  • Carrier sizes from 680 x 650 x 80 mm up to 825 x 650 x 80 mm

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Technical Data

CX600

Length

5.950 mm (inkl. Loading conveyor)

Depth

1.980 mm

Height

1.500 mm

Weight

1980 kg

Loading/unloading level, approx.

870 / 950 mm (variable)

Max. board size (manual loading / Batch)

680 x 646 x 65 mm

Max. board size (Inline)

680 x 305 x 45 mm

Medium agent filling

40 kg

Water connection

1/2" / 2,5-5 bar / 3,0l/min

Max. heating capacity of Vapor Phase heater

6,4 kW

Ø Energy consumptio/h

3,4 kW

Power supply

400/230 VAC, 50/60Hz, 6,8kW

Main fuse

20A, Typ "gL" oder "C"

 

Technical Data

CX800

Length

5.950 mm (incl. Loading conveyor)

Depth

2.390 mm

Height

1.500 mm

Weight

2090 kg

Loading/unloading level, approx.

870 / 950 mm (variable)

Max. board size (manual loading / Batch)

826 x 680 x 65 mm

Max. board size (Inline)

680 x 510 x 45 mm

Medium agent filling

45 kg

Water connection

1/2" / 2,5-5 bar / 6,0l/min

Max. heating capacity of Vapor Phase heater

10,4 kW

Ø Energy consumption/h

5,3 kW

Power supply

400/230 VAC, 50/60Hz, 10,7kW (16,0 kw)

Main fuse

32A, Typ "gL" or "C"

- Technical changes reserved -

 

 

IBL’s CX600/CX800 is fully automated inline vapor phase soldering solution. It provides precise, high quality results at medium to high volume throughput. The machines feature a standardised SMEMA interface for easy inline integration.

Applications

  • Telecommunications
  • Defence
  • Aerospace
  • Medical

 Key Benefits & Features

  • Vapor Phase Inline System for high volume throughput
  • A cycle time of under 20 sec. per board is possible
  • Carrier sizes from 680 x 650 x 80 mm up to 825 x 650 x 80 mm
  • Fully automatic inline operation
  • Two independent stations for loading and unloading of carriers
  • Loading and Unloading conveyors with buffer function
  • Three internal process chambers with automatic airlocks
  • Lowest energy and fluid consumption with Energy management system
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software without profiler
  • Traceability and documentation with IBL Software
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Batch and inline operation available
  • Siemens Interface available
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)