Lead-free solders for SMT electronics have a higher melting temperature than solders with lead. The convection heating technology is the ideal solution for the reflow process. It guarantees the precise control of the higher process temperatures and the minimum thermal stress for the sensitive electronic components.
Offering ease of operation, perfect reflow results and a robust construction, this R0300FC is well suited to continuous production, small batch manufacturing and prototyping. Precise zone separation allows the setup of profiles for all applications.
Ease of Operation
The integrated microprocessor control with LCD display provides an easy to-use operator interface. The memory includes preset program proposals and offers enough space for the operators own profiles.
The convection technology applies the same temperature everywhere on the board independent of component size or color, making programming as easy as possible.
With or Without Nitrogen
The RO300FC-N2 can be operated with air or nitrogen. The changeover takes less than five minutes.
Depending on the application, a mesh belt or a chain conveyor system can be used for substrate transport.
SMEMA connectors provide the ability to link the oven with any other compatible equipment.
With the optional flying thermocouples, temperatures can be recorded directly on the board and displayed on the machine’s LCD display.
Easy of Maintenance
For the cleaning of flux residues all necessary parts of the oven can be removed easily and can be cleaned outside the oven.