TWS Batch Reflow Convection Oven - 220 VOLT 850

TWS 850 is a powerful and compact reflow and convection oven with one heating zone ideal to perform soldering operation for small to prototype size SMT manufacturing, to cure adhesive and pastes and to remove humidity from fine pitch parts prior to reflow using hot bake function.


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Heating zones

One heating chamber

Maximum component height

120 mm

Maximum PCB size

330 x 240 mm

Maximum temperature


Power supply


Power consumption [max]



710 x 640 x 410 mm




Easy to use and with good performance, TWS 850 is a cheaper oven who allows to do solder operation in a really short time. Heating of the board is obtained by forced convection of hot air, a well-proven system. The electronic control system is designed to minimise power consumption. Even if is a small oven it is possible to obtain a great variety of thermal profiles where it can fulfil the most demanding requests. 


  • For small to prototype size SMT manufacturing
  • Laboratories

Key Features:

  • Enables to solder boards up to 330 mm length and 240 mm width
  • Powerful and compact.
  • Ideal for prototype to small volume production.
  • Easy to use touch screen LCD control panel.
  • Display of user instructions.
  • Display of set point & actual temperature for each heating phase.
  • Forced convection.
  • Lead free capable.
  • N2 version available
  • Efficient, low power consumption

Key Benefits:

  • Affordable
  • Solder operation is completed within a short period of time
  • Minimise power consumption