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Saki 3D Solder Paste Inspection Machine

Saki AOI designs and manufactures both 2D and 3D automated optical inspection (AOI) systems for printed circuit board (PCB) production.

With high-speed, high-volume production lines, an incorrect machine setting, placing the wrong part on a PCB, or having a problem with alignment could result in a large number of manufacturing defects and subsequent rework in a short amount of time. The original AOI machines were capable of 2-dimensional measurements, such as checking board features and component features to determine X and Y coordinates and measurements. 3D systems have expanded on 2D, adding the height dimension to the equation, thereby providing X, Y, and Z coordinates and measurements.

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Dimensions

L

Single Lane

L

Dual Lane

XL

Single Lane

Model Name

3Si-LS2

3Si-LD2

3Si-ZS2

Size (W) x (D) x (H)

(mm)

1040 x 1440 x 1500

1340 x 1440 x 1500,

Weight

900kg

Electric Power

Single Phase – 200-240V+/-10%, 50/60Hz

Air Requirement

0,5MPa, 5L/min (ANR)

PCB Size

(mm)

-

Single

mode

Dual

mode

-

 

(7Nm camera head)

(7Nm camera head)

50 x 60 – 686 x 870

1.97 x 27,00 x 34.25

90 x 60 –

330 x 330

1.97 x 2.36 – 12.99 x 12.99

50 x 60

330 x 330

1.97 x 2.36

12.99 x 12.99

50 x 60

320 x 330

1.97 x 2.36

12.60 x 12.99

(12/18Nm camera head)

50 x 60 – 500 x 510,

1.97 x 2.36 – 19.68 x 20.07

(12/18 Nm camera head)

50 x 60 –

500 x 510,

1.97x 2.36

19.68x20.07

50x60

320x510

1.97x2.36

12.60 x 20.07

PCB Clearance

Top: 40mm, 1.57in.

Bottom: 60mm, 2.36in.

Top: 40mm, 1.57in.

Bottom: 50mm, 1.96in.

Top: 40mm, 1.57in.

Bottom: 60mm, 2.3in.

Overview

A new addition to the Hawker Richardson range, solder paste inspection. Saki's inspection technology is used in the assembly of circuit boards for a broad spectrum of products, such as smart phones with micro-size parts, on-vehicles, industrial devices with tall parts, and power supply circuit integrated servers and much more. Today with component miniaturisation and design advancements, Saki SPI provides high precision inspection of very small components with increased inspection speed achieving non shadowed inspection on the component.
The high accuracy of Saki’s 3Si and 3Di series ensures accurate feedback and feed forward to printers and pick and place machines. Feedback and misalignment data from the SPI machine to the printer improves the quality and reliability of the solder paste printing process. The system further prevents print quality issues by monitoring cleaning cycles and promoting the printer to when the stencil needs cleaning.

Feeding the print position measurement data from the SPI machine to the pick and place machine enables placement positions to be adjusted to improve quality. While a bad board skip function alerts the pick and place machine not to place components on a bad board. These functions reduce component waste and increase efficiency. Using components placement measurement in the AOI machine enables adjustments to be made to placement positions for improved reliability and quality.
Saki corporation proprierty technology and accurate M2m connection offers a smart factory solution that controls and improves production productivity for the entire factory.

Saki SPI

  • Flaws
  • Checking for hairline cracks
  • Contamination
  • Scratches
  • Defects

Key Features

  • Propriety hardware provides accurate measurements
  • Self diagnostic system
  • Optical unit
  • Side Cameras
  • Advanced software features

Key Benefits

  • Remarkable speed 
  • True height measurement