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Yamaha Ysi-V Optical Inspection Machine

The impressive Yamaha YSi-V is a hybrid, automated, optical inspection (AOI) system offering high-speed, high-resolution image processing and image capture technology.

In one single unit, the Yamaha YSi-V can perform high-speed, high-resolution 2D inspection, height and tilt angle 3D inspection and diagonal angle image inspection via a 4-direction angled camera.

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Model Name

YSi-V

Applicable PCB

L50 mm×W50 mm (min.) to L610 mm×W560 mm (max.)

(in single-lane spec)

*L750 mm long type PCB compatible (option)

Resolution

Optical light (RGB) & infrared light: 12 μm / 7 μm (selectable)

Target items

Condition of components after mounting

Condition of solder and components after hardening

Power supply

3-phase AC200/208/220/230/240/400/416V ±10% 50/60 Hz

Air supply source

0.4 MPa or higher in clean, dry states

External dimensions

L1,252×W1,497×H1,550 mm (excluding protrusions)

Weight

Approx. 1,300 kg

Overview

To achieve higher levels of operating speed, the Yamaha YSi-V features a 12 megapixel high-resolution camera, high-speed image processing technology, 3D inspection function, (that checks component height and tilt angle simultaneously), and a 4-direction angled camera employing exclusive image capture technology.

The YSi-V offers more than twice the inspection capacity/performance of the YSi-12 and introduces new features including full-HD LCD touch panel, "programming navigation" and new character recognition algorithms to improve operability.

Available with both 2D & optional 3D capability, with either 5 MP camera or as a high-end type with a 12 MP camera.

The 4V vision system enables angular inspection from four directions (45°, 135°, 225°, 315°). The Ysi V utilises 5 different inspection methods – laser, shape, colour, infrared & brightness, providing flexible and reliable imaging and inspection results.

The 3D imaging option reliably detects floating components that a 2D inspection system can miss. Detection is also improved where colour tones between board and components are similar or when there is interference between silk-screen and pattern. YSi-V 3D inspection can also detect the slope gradient and direction, and make pass/fail contour judgements.

 Applications

  • Checking for cracks
  • Flaws
  • Contamination
  • Scratches
  • Defects

Key Features

  • Enhanced 2D inspection capability with the adoption of newly developed high-speed, high-resolution image processing technology
  • New 3D inspection function that inspects component height and tilt angle in the field of vision simultaneously
  • Accommodates larger PCB sizes
  • Improved operability

Key Benefits

  • Ensure consistent quality and operational efficiency
  • High flexibility
  • Low maintenance costs
  • Enhancing production efficiency for manufacturers