Yes it is used to help assist in ease of programming.
3. What can the 3D/4D head options do?
3D will inspect for warpage, tombstoning, solder fillets angles and etc. This 3D option can be turned off and not used it’s a selectable option. 4D is only used as an AFTER check. What the after check involves is the images are captured via the 4 camera system which is only used INSTEAD OF picking the board up and looking obliquely at parts. The images are captured for your benefit as an inspection option. 4D is not an inspection criteria that is used in any way automatically by the machine or as part of your inspection program. The 3D/4D head options cannot be separated because they are both using the same camera/projector set up.
4. What is IPC criteria inspection?
The IPC is a separate jurisdiction and a guide most assemblers and equipment manufactures follow, they set the rules and acceptance criteria for PCB assembly
5. How do the 3D and 4D options work together?
3D will allow you to check using a 3D measurement projector and the 4 x cameras. Allowing you to check for lifted parts, tombstoning, dry joints, solder angles and PCB warpage by checking set points. 4D is using the 4 directional cameras as well, hence the need that the two are locked together. 4D is really a pseudo system, that allows you to check the images captured, so instead of picking up the board and tilting to see lifted legs, the system has captured oblique views and its used like an image judgement system. The 4 angular cameras are used to make the 3D Live image. Another option instead of 3D is to have a rotary geared laser with the 2D, instead of 3D, this will check programmed heights with the laser again checking for tombstoning and warped PCBS, but will be much slower due to checking single locations one at a time.
To achieve higher levels of operating speed, the Yamaha YSi-V features a 12 megapixel high-resolution camera, high-speed image processing technology, 3D inspection function, (that checks component height and tilt angle simultaneously), and a 4-direction angled camera employing exclusive image capture technology.
The YSi-V offers more than twice the inspection capacity/performance of the YSi-12 and introduces new features including full-HD LCD touch panel, "programming navigation" and new character recognition algorithms to improve operability.
Available with both 2D & optional 3D capability, with either 5 MP camera or as a high-end type with a 12 MP camera.
The 4V vision system enables angular inspection from four directions (45°, 135°, 225°, 315°). The Ysi V utilises 5 different inspection methods – laser, shape, colour, infrared & brightness, providing flexible and reliable imaging and inspection results.
The 3D imaging option reliably detects floating components that a 2D inspection system can miss. Detection is also improved where colour tones between board and components are similar or when there is interference between silk-screen and pattern. YSi-V 3D inspection can also detect the slope gradient and direction, and make pass/fail contour judgements.
Checking for cracks
Enhanced 2D inspection capability with the adoption of newly developed high-speed, high-resolution image processing technology
New 3D inspection function that inspects component height and tilt angle in the field of vision simultaneously
Accommodates larger PCB sizes
Ensure consistent quality and operational efficiency