Reflow Thermal Profiling
THERMAL PROFILER SOLUTIONS WITH 6 TO 16 CHANNELS
The SolderStar PRO thermal profiler systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system. The datalogger unit is docked into a protective heat shield and thermocouple adapter combination to provide the number of measurement channels required for the product profiling applications. Future upgrading or servicing is a simple and cost effective procedure, with only the Thermocouple Adapter needing to be changed to allow 6,9,12 or 16 Type-K measurement versions.
The‘SmartLink’ concept results in a smaller profiling instrument footprint, allowing the systems to easily pass though ovens with low tunnel heights or when narrow electronic assemblies are being produced. Additionally it provides a quick connection to a range of accessories for capture of profile and SPC information from reflow, wave/selective and vapour phase soldering processes.