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Martin Reballer Mini Oven 05

The compact and robust design of the Minioven 05 is specially designed for re-balling of BGA’s and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats up the electrical components like a standard reflow oven: gently and simultaneously from all sides and guarantees repeatable process results with high yield. The Minioven 05 is ideal for use in production and R&D environments.

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Overview

The large display and four button front panel layout enables fast set-up and administration of up to 25 re-balling profiles, which can be saved in the device. The MINIOVEN 05 uses readings from a second temperature sensor which is connected to the oven and attached next to the BGA to measure the IC temperature. An input for the use of process gases (such as nitrogen) is factory set.  

The PC software EASYBEAM is included and can be used to download profiles, i.e. for easy back-up and upload of re-balling profiles from a production server. EASYBEAM V2 connects via USB and can also display temperature plots of the two sensors and allows optimisation of profile parameters to fit user expectations.

A wide range of tooling and accessories available for BGA and QFN pre-bumping.